Architecture Overview
This overview introduces the main design goals behind the reference architecture: interoperability validation, high-performance design, topology flexibility, breakout planning, and deployment support.
Reference Architecture Guide
Short Answer
GPU systems, Ethernet fabrics, InfiniBand fabrics, breakout cables, optical media, switch platforms, NICs, and rack layouts all need to work together before the design moves into production. Use these 400G, 800G, and 1.6T reference patterns to compare media type, reach, topology, breakout format, and deployment use case.
AI fabrics place more pressure on the physical layer than traditional enterprise networks. The correct design depends on workload, topology, rack density, switch platform, NIC support, media type, distance, thermals, and validation requirements.
For broader AI networking planning, review the AI Networking Infrastructure Guide and the Data Center Networking Resource Center.
DAC, AEC, AOC, SR4, DR4, FR4, and LR4 each fit different rack distances, power profiles, reach requirements, and deployment patterns.
400G, 800G, and 1.6T ports often need breakout planning before the BOM is finalized.
Switches, NICs, adapters, firmware versions, and optics should be validated together before production deployment.
AI racks need review for form factor fit, cable bend radius, airflow, faceplate density, service loops, and physical access.
Axiom helps teams review optics, cables, breakouts, media choices, compatibility, diagnostics, and deployment risk.
This overview introduces the main design goals behind the reference architecture: interoperability validation, high-performance design, topology flexibility, breakout planning, and deployment support.
The diagrams separate copper, multimode fiber, and single-mode fiber paths so teams can quickly see what media type each pattern uses.
These patterns show how 400G, 800G, and 1.6T links connect GPU nodes, switches, NICs, servers, leaf tiers, and spine tiers. Use them as starting points for design review, with platform validation before production.
Best for GPU node connectivity in AI clusters where ultra-low latency and high-density racks are priorities.
Best for connecting 400G switch ports to 200G servers, GPU adapters, or scalable leaf nodes.
Best for high-density spine-to-leaf Ethernet designs and next-generation AI cluster fabrics.
Best for spine uplinks and hyperscale fabrics that need dual 400G endpoints from an 800G port.
Best for top-of-rack aggregation and server fanout where 400G uplinks connect to 100G endpoints.
Best for short-reach switch-to-switch or leaf connections using multimode fiber.
Best for longer reach switch-to-switch, data center interconnect, and leaf-to-spine paths.
Best for high-bandwidth 800G spine interconnects, AI fabrics, and 800G backbone links.
These supporting references help teams compare media types, validate mechanical fit, review NIC ecosystem examples, and choose topology patterns before a design is finalized.
Compare DAC, AEC, AOC, SR4, DR4, FR4, and LR4 by connector, reach, and use case.
Review form factor support, cable examples, host compatibility, and physical fit before deployment.
Review common NICs, adapters, switches, and platforms used across AI infrastructure environments.
Compare spine-leaf Ethernet fabrics, GPU pod clos fabrics, and rack-level deployment examples.
AI interconnect planning should include platform compatibility across switches, NICs, adapters, and server environments.
Use this checklist before moving from a reference architecture into procurement, staging, or production deployment.
An AI interconnect reference architecture is a reusable design pattern that shows how switches, NICs, GPU nodes, optics, cables, media types, and breakout formats work together in an AI fabric.
AI interconnects require more planning because GPU clusters depend on high-throughput, low-latency east-west traffic, dense rack layouts, specific NIC and switch support, and validated physical-layer behavior.
Common media types include DAC, AEC, AOC, SR4, DR4, FR4, and LR4. The right media depends on distance, speed, power, density, cable routing, connector type, and platform support.
DAC is best for short-reach, high-density rack-level connections where low latency, low power, and predictable cable paths are priorities.
Optical transceivers are better when the link needs longer reach, single-mode or multimode fiber, structured cabling, spine-to-leaf distance, or cleaner cable routing across rows or rooms.
Breakout planning matters because 400G, 800G, and 1.6T ports often connect to multiple lower-speed endpoints. The breakout format must match switch support, NIC speeds, cable type, optics, and topology.
Validate switch and NIC compatibility, speed, lane rate, breakout format, media type, connector, reach, cable path, thermals, diagnostics, traffic stability, logs, error counters, and failure recovery.
Axiom helps teams review optics, DAC, AOC, AEC, breakout options, platform compatibility, diagnostics, cable paths, thermal concerns, and deployment risk before AI interconnect hardware reaches production.
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Send Axiom your switch platform, NIC or adapter type, target speeds, breakout requirements, cable path, media preference, rack layout, and deployment timeline. Axiom's networking team will help review interconnect options, compatibility requirements, and deployment risks before hardware reaches production.
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