Date: 10/29/25

Flash and Memory Prices Surge As AI Demand Shifts Global Memory Production

 

What’s Happening:

Analysts report Samsung is pushing for DRAM contract prices by 15–30% and NAND by 5–10% in Q4.

Micron has slowed new quotations in some channels and signaled 20–30% DRAM price increases.

SK Hynix is expected to follow similar pricing actions, tightening the DRAM channel.

 

Why Prices Are Climbing:

AI & HBM Demand Surging: Chipmakers are shifting wafer capacity to High-Bandwidth Memory for AI data centers.

Reduced DDR4/DDR5 output as suppliers prioritize higher-margin HBM and maintain disciplined wafer utilization

Tightening Supply = Stronger Pricing Power: With limited availability, suppliers are controlling costs and lead times more aggressively.

 

What to Expect:

Higher memory pricing through late 2025 Potential lead-time extensions

Volatility in DRAM contract pricing across the channel

 

Recommended Action:

Purchase supply early and plan ahead for upcoming projects. Forecasting and early PO alignment will minimize the impact of price volatility. Plan ahead - Contact us for current pricing and lead times

About the Author

Carlos Berto
Director of Network Engineering, Axiom

Dr. Carlos Berto, Ph.D., leads Axiom’s Network Engineering division, where he helps enterprise and hyperscale data centers maximize performance, reliability, and energy efficiency.

With more than 25 years of leadership experience in the telecommunications and data infrastructure industries, Dr. Berto has overseen the development of next-generation optical, memory, and interconnect technologies that power modern AI and HPC systems.

A recognized expert in advanced networking, Dr. Berto holds a Ph.D. in Engineering and has authored numerous technical insights on topics ranging from 1.6T transceivers to liquid cooling for AI clusters. His work bridges theory and practice translating complex engineering concepts into actionable strategies that IT leaders can use to future-proof their infrastructure.

Focus Areas

  • Optical and Interconnect Technologies
  • AI and High-Performance Computing (HPC) Infrastructure
  • Network Design and Power Efficiency

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Inside The Stack: Trends & Insights